Plenary Sessions

||Plenary Sessions
Plenary Sessions2019-08-17T14:24:58-04:00

Plenary Session
September 30, 2019
8:30am – 11:15am

 

Five distinguished leaders from industry and scientific community will share their wisdom and visions with us at Plenary Session:

Dr. Alain Charles, Vice President, Technology Development Center, Infineon Technologies Americas Corp., Title: Integration of Gallium Nitride in Power Applications: Achievements and Challenges

Dr. Babu Chalamala, Director of Energy Storage Systems, Sandia National Laboratories, Title: Emerging eT&D Grids: Energy Storage, Electrification, and the Increasing Role of Power Electronics

Dr. Don Tan, NGAS Distinguished Engineer and Power Products Manager, Northrop Grumman Aerospace Systems, Title: Ultra High Power Density Demands 99% Efficiency and 99% Duty Ratio

Dr. Lauren Boteler, U.S. Army Research Laboratory (ARL), Advanced Power Electronics Group, Title: Co-Design: A Paradigm Shift to Enable Next-Generation Power Modules

Mr. Patrick J. O’Neill, Director of the U.S. Army Command, Control, Communications, Computers, Cyber, Intelligence, Surveillance, and Reconnaissance (C5ISR) Center, Title: Power and Energy for the Future U.S. Army


+ Dr. Alain Charles, Vice President, Technology Development Center, Infineon Technologies Americas Corp.

Title: Integration of Gallium Nitride in Power Applications: Achievements and Challenges

Abstract: The U.S. Department of Energy has recognize the opportunity to reduce dramatically usage of electricity in homes and businesses through adoption of variable speed motor control. An estimated 535 x 1012 BTU of energy could be saved annually in the US through use of variable speed drive (VSD) in home appliances and an additional 461 x1012 BTU’s when commercial appliances are considered. In total, this is the equivalent of reducing annual release of greenhouse gases due to the usage of 5.5 million short tons of coal.Today VSD are inverterized based on state of the art (SOA) silicon based power solution using either 6 FREDFET power MOSFET or 6 IGBT/FRD pairs together with a gate driver IC capable to drive all 6 switches as a voltage source. The proposed concept is to leverage existing 600V normally off (e-mode) CoolGaNTM switches for use in our VSD “power stages” which feature package integration of 6 GaN HEMT. The reverse recovery performance of CoolGaNTM, provides substantial advantage in term of turn on Loss at full and partial load enabling > 50% reduction in power loss. For successful adoption in motor control, 3 elements of a GaN-based solution are required:

a.) a low cost driver IC which provides current source drive signal as the CoolGaNTM gate is current driven, and protect functions (control slew rate to <5V/ns). The IC must also cost no more than existing low cost voltage source IC’s used with silicon. In this paper, we will describe the proposed solution to realize this IC based on Junction Isolated level shifting technology. b.) A Competitive cost GaN devices. For RDS(ON) values in the 1 ohm range CoolGaNTM die are 5x to 6X times smaller than FREDFET’s so that even with higher wafer cost per area the GaN die cost will be lower than silicon. On top, the lateral nature of the GaN device brings the potential further advantage to integrate monolithically the 6 GaN switches into one die. The paper, will show the challenge to do so, due to the back gating of the high side switch by the low side switch, due to the common silicon substrate, and the proposed remedy to this problem. c.) A low cost surface-mount package solution achieved through the simplification of the 12×12 mm QFN package due to the monolithically integrated GaN switches, which reduces the number of components in the package from 7 (or 13 in case of IGBT) to 2.

Bio: Dr. Charles is a 30 years semiconductor industry veteran. He received his Ph.D. in 1989 from the Institut National des Sciences Appliquées (INSA) de Toulouse (France) for his work on optical lithography for microelectronics. Through his international career, Dr. Charles was involved in most of the key technology changes of the semiconductor industry, like subwavelength pattern printing, to larger wafer (300mm) technology development to power efficiency and introduction of wide bandgap semiconductors. His international career started from driving Optical lithography effort at Motorola Mesa site (AZ, USA) and later ST-Microelectronics factory in Carrollton, (TX, USA).  He later joined Motorola-Siemens Joint venture in Dresden pioneering 300mm Silicon manufacturing in Dresden, Germany, and was part of the team that produced the first 64Gbit DRAM on 300mm wafers in 1998. He then managed Fab5 and Fab3 engineering teams at Silicon Foundry Chartered Semiconductor (today Global Foundries) in Singapore.  In 2003 is joined International Rectifier power device technology development team, in Newport (Wales, UK), to finally head the silicon technology development team for all discrete power devices from company headquarter in El Segundo, CA, USA. After Infineon acquisition of International Rectifier, he took the worldwide responsibility for the Gallium Nitride technology development initiative within the company.

+ Dr. Babu Chalamala, Director of Energy Storage Systems, Sandia National Laboratories

Title: Emerging eT&D Grids: Energy Storage, Electrification, and the Increasing Role of Power Electronics

Abstract: Emerging electronic transmission and distribution (eT&D) grids will evolve rapidly accommodating the changes in generation mix and load profile that are associated with increasing renewable and distributed generation, electrification and bidirectional power flows. For eT&D grids to operate reliably with a high degree of autonomy, there is a greater need for energy storage systems and intelligent power conversion systems with advanced circuit topologies and high speed communication infrastructure. Current challenges for the future eT&D grids include limited scale of energy storage deployments along with low penetration of power electronics in the current grid infrastructure. As we look into a future with 70-80% renewables in the generation mix and higher amounts of dc loads including electric vehicles and appliances, the load profile and operational aspects of the grid will experience changes that are not well forecast. In this presentation, I will review state of eT&D grid development, expected developmental pathways, and projections for eT&D grid in the distant future.

Sandia National Laboratories is a multi-mission laboratory managed and operated by National Technology & Engineering Solutions of Sandia, LLC, a wholly owned subsidiary of Honeywell International Inc., for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-NA0003525.

Bio: Dr. Babu Chalamala is Head of the Energy Storage Technology and Systems Department and Laboratory Program Manager for Grid Energy Storage at Sandia National Laboratories, Albuquerque, NM. Prior to joining Sandia in 2015, he spent twenty years in industry R&D, mostly recently as a Corporate Fellow at MEMC Electronic Materials/SunEdison where he led R&D and product development in grid scale energy storage. Before that, he was involved in two startup companies for eight years. He spent early part of his research career at Motorola and Texas Instruments where he made contributions to electronic materials and display technologies. He has a B.Tech. in Electronics and Communications Engineering from Sri Venkateswara University and a PhD in Physics from the University of North Texas. An IEEE Fellow, he served on the editorial boards of Proceedings of the IEEE, IEEE Access and IEEE Journal of Display Technology. He currently serves on the as Vice Chair of IEEE PES Energy Storage and Stationary Battery Committee and as a Member of the IEEE Fellow Committee. He has also been active in the Materials Research Society, where he served as a General Chair of the 2006 MRS Fall meeting. He currently serves on the MRS Government Affairs and Award Committees. Author of over 120 papers, several edited volumes, and awarded 10 US patents.

+ Dr. Don Tan, NGAS Distinguished Engineer and Power Products Manager, Northrop Grumman Aerospace Systems

Title: Ultra High Power Density Demands 99% Efficiency and 99% Duty Ratio

Abstract: Recent technology progress demonstrated effective ways of obtaining 99% power efficiency. The near adiabatic power conversion technology, for instance, needs no dedicated thermal management. Yet ultra-high power density has eluded many designs. The most recent technology trend in power conversion, particularly for dc-dc, suggests a significant increase in power density is within reach. Ultra-high power density in commercial products demands a 99% efficiency and a virtual full duty ratio (say, 99%). The path forward requires a systematic approach in leveraging distributed low-profile packaging, minimum inductive storage, capacitive energy transfer, partial power processing, integrated WBG devices, modularity, and scalability. It is anticipated that the power electronics industry will achieve an-order-of-magnitude improvement in achievable power density within the coming years. 

Bio: Dr. Tan is NGAS Distinguished Engineer and Power Products Manager. He earned his Ph.D. degree from Caltech and is IEEE Fellow (since 2007). Well-recognized as an authority in near adiabatic power conversion and energy systems, he has pioneered many breakthrough innovations with high-impact industry firsts and record performances. His technologies have attracted significant customer funding and led to four product lines for the company and with hundreds of designs and thousands of delivered flight hardware that “significantly enhancing national security.” He has given more than 50 keynotes and invited talks. He serves frequently on national and international funding, review, award, and prestigious position selection committees.

+ Dr. Lauren Boteler, U.S. Army Research Laboratory (ARL), Advanced Power Electronics Group

Title: Co-Design: A Paradigm Shift to Enable Next-Generation Power Modules

Abstract: The Army is moving to a more electrified force for an increasing number of applications including vehicles, renewables, tactical energy networks, communications, and weapons systems. Current power electronics devices are unable to realize their full potential due to the challenges of standard packaging including thermal dissipation, reliability, and parasitic inductance. As technology advances, the electrical, thermal, and reliability needs of these systems must be simultaneously accounted for due to the need for more power in smaller units with no loss in performance. Unfortunately, most research has focused on solving only one technical challenge: a better heat sink, a better circuit design or a more reliable material. When thermal design is treated as a discrete step and not addressed until the end of development, systems become large, overly complex, and inefficient. This presentation will introduce the concept of co-design, a paradigm shift which moves away from the siloed approach to design and transitions into multi-disciplinary design to enable holistic improvement for next generation power electronics. The presentation will cover the current thermal and packaging challenges associated with power modules and will define the three key enabling capabilities to enable future power modules and next-generation cooling solutions: (1) parametric modeling tools, (2) additive manufacturing and (3) transient thermal mitigation.

Bio: Dr. Lauren Boteler leads the thermal and packaging research programs as part of the Advanced Power Electronics group at the U.S. Army Research Laboratory (ARL). She received her PhD degree in mechanical engineering from the University of Maryland. Her work at ARL, beginning in 2005, has included electronics packaging and thermal management solutions for a wide range of Army applications. Her focus is on design tool development and package integrated thermal solutions including 3D chip stacking, power electronics, laser diodes, double side cooling, and phase change materials. More recently, she has initiated a research program in Advanced Power Electronics Packaging and Thermal Management which defined the four main challenges and opportunities of power electronics packaging: co-engineering/co-design, transient thermal mitigation, additive manufacturing, and high-voltage packaging. She is an adjunct professor at Johns Hopkins University and was awarded the 2018 ASME EPPD Woman Engineer of the Year award for her contributions to the electronics packaging community.

+ Mr. Patrick J. O’Neill, Director of the U.S. Army Command, Control, Communications, Computers, Cyber, Intelligence, Surveillance, and Reconnaissance (C5ISR) Center

Title: Power and Energy for the Future U.S. Army

Abstract: The U.S. Army recently established the Army Futures Command to develop revolutionary technology for military applications. Intelligent power and energy architecture will be essential as the Army’s needs for mobile power continue to grow. The Army has achieved considerable success in improved fuel consumption by applying the principles of smart grids to battlefield electric power generation. A further level of sophistication must be implemented to such grid design because the number and power ratings of power generators and loads may vary often over time and location. Areas of opportunity for such power and energy technology include advanced power sources, including renewables, generators and batteries, advanced power conditioning devices and more sophisticated thermal management.

Bio: Mr. Patrick J. O’Neill is the Director of the U.S. Army Command, Control, Communications, Computers, Cyber, Intelligence, Surveillance, and Reconnaissance (C5ISR) Center. As Director, he is responsible for establishing C5ISR Center’s comprehensive Science and Technology (S&T) Portfolio providing strategic program formulation guidance involving short-and long-range goals utilizing existing and anticipated state-of-the art advances in communications, mission command, sensors, electronic warfare, intelligence and countermeasure equipment and services. Programs encompass technology thrusts in Mission Command, Communications, Intelligence, Surveillance, and Reconnaissance technologies and systems in various stages of the life cycle model. In addition to the center’s S&T mission, he oversees its engineering support and services provided to the acquisition Program Executive Offices, Life Cycle Management Commands, and other DOD and Federal customers.

Mr. O’Neill was appointed to the Senior Executive Service in March 2011. In his previous position, he served as the Chief Technology Officer for U.S. Army Materiel Command (AMC), located at Redstone Arsenal, Alabama from October 2014 to November 2017. As the senior civilian technical authority for science, technology and engineering, he was responsible for developing and executing a long-term research, development, technology, and engineering transformation strategy for AMC and the Army. In this role, he led and established the technical vision for AMC technology development, set the strategic direction for a full range of Army systems investments, and drove strategic alignment with the Assistant Secretary of the Army for Acquisition, Logistics and Technology and the U.S. Army Training and Doctrine Command to ensure rapid and responsive delivery of products.

Prior to that, Mr. O’Neill served as the Acting Director, U.S. Army Materiel Systems Analysis Activity (AMSAA) from November 2012 to July 2013. As Acting Director, he executed a budget of more than $100M, and oversaw a multi-disciplined workforce of more than 325 analysts, engineers, mathematicians, and scientists that provide lifecycle materiel/ logistics systems analysis to support the AMC and senior decision makers across the Army. He was also responsible for the oversight of the DoD Joint Technical Coordinating Group for Munitions Effectiveness and for developing/providing joint service-approved methodology, Modeling and Simulation, data and analysis for Army systems. He served as Technical Director from March 2011 to November 2012, and was responsible for overseeing the entire Technical Program performed by approximately 325 analysts within AMSAA.

Mr. O’Neill, who is Army Acquisition Corps Certified Level III in two functional specialties – Test and Evaluation and Systems Planning, Research, Development and Engineering – received the Meritorious Civilian Service Award in 2011 and 2015, the Department of the Army Wilbur Payne Systems Analysis Award, and multiple AMC Systems Analysis Awards. He holds two Master of Science degrees: one in National Resource Strategy from the Industrial College of the Armed Forces, Washington D.C. in 2000, and the other in Computer Science from Johns Hopkins University, Baltimore, Maryland, in 1983. In 1979, he earned a Bachelor of Science from Loyola University, Baltimore, Maryland, with a double major in Mathematics and Computer Science.

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