Student Project Demonstrations

Important Dates

The IEEE ECCE Committee on Student Activities and the IEEE Power Electronics Society (PELS) Technical Committee on High-Performance and Emerging Technologies (TC6) are pleased to announce the ECCE 2023 Student Project Demonstrations on Emerging Technology Award Program.

Since 2011, ECCE has organized the hardware demo event for students to showcase their research outcomes and interact with academia and industry. Starting 2013, IEEE PELS TC6 has sponsored this hardware demo event at ECCE as the student project demonstrations on emerging technology award program. Three prizes are awarded at ECCE to the best student project demonstrations. This event has also established a social network among students from different universities and countries.

Topics of Interest

Topics of interest include but are not limited to:

• Energy harvesting
• 3D power electronics integration
• Wireless power transfer
• High temperature power electronics
• Ultra-efficient and high-power-density converters and inverters
• Emerging power devices (e.g., SiC, GaN) and their applications
• Emerging solutions for passive component used in power electronics
• High reliability power electronic components and converters
• Artificial intelligence and machine learning
• Design automation and simulation tools
• Digital twin and cyber-physical security of power electronics
• Other emerging power electronic applications and related technologies

Submission Guidelines and Award Details

To participate in the student project demonstrations on emerging technology award program, fill out this online application form by July 15, 2023. If you have difficulty accessing this form, please email katherine.kim@ieee.org with your name, school, and faculty advisor’s name & email.

Single student project teams will be given preference, but teams with up to three students are allowed. For teams with multiple students, only one student needs to fill the application form. Topics of interest include all emerging areas of power electronics and related technologies. A non-exhaustive list of topic areas of interest is given below. Project teams selected for participation will be notified by August 1, 2023. All members of the selected project teams must register for ECCE in order to participate in the demonstration event.

Travel grants of $400 will be allocated for each participating project team (this amount may vary depending on the number of teams participating, as the total travel budget is $6,000). Team members must submit travel related receipts and the travel grant will be disbursed against actual expenses up to the team’s allocated amount. Team members and project advisors will be invited to a sponsored dinner during ECCE.

For the demonstration, each team will be provided (free of cost) roughly 5-feet by 10-feet space in the ECCE exhibition hall. It is recommended that teams demonstrate hardware prototypes, and utilize posters, slides and/or videos (recorded at their home institution) to explain their demo to the audience and the judges. A power outlet will be available to each team to run a computer. However, the demonstrated hardware and experiments cannot be run in the exhibition hall due to safety concerns. Any participant who violates this rule will be disqualified.

Each project demonstration will be evaluated by a judging panel comprising members from the industry and the academia. The panel members will select the top project demonstrations based on originality/creativity, engineering design, value to practical applications, presentation, and audience appeal. The top three student project teams will be recognized with the Student Project Demonstration on Emerging Technology Award as follows:

• 1st Prize (a certificate and a cash award of $700)
• 2nd Prize (a certificate and a cash award of $500)
• 3rd Prize (a certificate and a cash award of $300)

The top student project team participating in the Student Design Methodology Competition track will be recognized with the:

• Best Student Design Methodology Award (a certificate and a cash award of $500)

Videos of the winning project demonstration may be posted on the IEEE PELS TC6 or TC10 websites.

Confirmed Student Demonstrations

Flexible Manufacturing Plant Controller Testing Demonstration
Dingrui Li, Mohamed Al Sager, University of Tennessee

UAV Autonomous Wireless Charging Demonstration
Stephen Paul, Muhammad Abdelraziq, Ujjwal Pratik, North Carolina State University

Fiber-optic-less isolated gate driver with power-signal integrated transmission for 10-kV SiC MOSFETs
Zhehui Guo, Florida State University

Power Converter with Immersion Cooling for Transportation Applications
Reza Ilka, Yiju Wang, Majid T. Fard, University of Kentucky

Rare-Earth and Heavy Rare-Earth Free EV Traction Motors
Ritvik Chattopadhyay, Sodiq, North Carolina State University

High Power-Density Single-Stage 48/1.8V Converter with Easy-to-Design Discrete Magnetics
Xin Lou, Virginia Tech

EMI Filter Integration for GaN Power Modules Using Air-Cured Magnetic Composite
Niu Jia, Xingyue Tian, University of Tennessee Knoxville

A Transformer Design with PCB Litz Wire Concept for Solid State Transformer
Zheqing Li, Feng Jin, Virginia Polytechnic Institute and State University

Modular Multilevel GaN Based Ultra-high Power Density Electric Power Conversion on the Lunar Surface
Yuzhou Yao, The Ohio State University

Liquid Metal Cooled Ultra High Power Density Inverter with Integrated MHD Pump
Junchong Fan, Siddhant Shah, Zhang, The Ohio State University

A Modular Switched-Capacitor Chip-Stacking Drive Platform for kV-Level Electrostatic Actuators
Yanqiao Li, Bahlakoana Mabetha, Dartmouth College

Ultra-High Power Density 240W AC-DC Converter Based on Novel STAR Architecture and GaN
Lei Wang, The University of Sydney

Picogrid: An experimental platform for prosumer microgrids
Maitreyee Marathe, University of Wisconsin-Madison

An Efficient and Robust Controller Design Automation Tool for Power Electronics: Enhancing Design for Manufacturing
Wanrong Li, Yuhan Zhang, The University of Sydney

A Dense and Efficient Cryogenic Power Converter
Aaron Wadsworth, The University of Auckland

3D printed heat exchanger for achieving high current density in electric motors
Gokhan Cakal, Ahmed Hembel, University of Wisconsin-Madison

Multi-objective Design Optimization For High-bandwidth Printed Circuit Board Shielded Rogowski Coils
Xingyue Tian, University of Tennessee, Knoxville

A Scalable Electronic-Embedded Transformer (EET), a New Concept toward Ultra-high-frequency High-power Transformer in DC-DC Converters

Yuliang Cao, Virginia Tech

A Non-isolated Fixed-ratio DC-DC Converter Using Switched Autotransformer (SATx) for Data Center Applications
Xufu Ren, University of Cambridge

Design and Integration of SiC Gate Drivers Inside Commercial SiC Power Modules
Asif Faruque, University of Arkansas

A Novel Hybrid Core Structure for 100kW Medium Frequency Transformers
Chen Chen, The University of Texas at Austin

An Isolated Bidirectional DC-DC Converter with High Voltage Conversion Ratio and Reduced Output Current Ripple
Zhining Zhang, Yue Zhang, Boxue Hu, The Ohio State University

PowerBrain-An automatic datasheet information extraction Tool
Fanghao Tian, Hans Wouters, Yu Zuo, KU Leuven

A 6.6kW on-board charger with GaN switches and PFC+CLLC Topology
Hans Wouters, Fanghao Tian, Yu Zuo, KU Leuven

MagNet AI: Online Neural Network Platform for Modeling and Simulation of Power Magnetic Materials
Haoran Li, Shukai Wang, Princeton University

Enhancing Virtual Synchronous Machines: Operating Grid-Forming Inverters with Power Angle in Four Quadrant Range

Armando Jose Ferreira, Federal University of Campina Grande

Interactive Multi-Objective Design Optimization of Power Converters
Benjamin Luckett, University of Kentucky

Medium Voltage Current Source Inverter for High-Speed Motor Drive Applications
Sneha Narasimhan, North Carolina State University

RazorPack Advanced Power Module Packaging
Xiaoling Li, Yuxiang Chen, Hao Chen, University of Arkansas

Matrix Autotransformer Switched-Capacitor DC-DC Converter for Datacenter Application
Haoran Meng, Maohang Qiu, Xiaoyan Liu, University of Dayton